Camera Handler for Semiconductor Wafer Inspection

　　Semiconductor wafer inspection faces pain points: nanoscale defect missed detection (≤0.1μm), fragile thin-wafer (50-100μm) damage risk, and strict cleanroom requirements. This camera handler, with "nanoscale precision, micro-defect recognition, and cleanroom adaptability," enables "wafer alignment→defect scanning→data tracing" closed-loop, ensuring wafer yield and chip reliability.

　　1. Nanoscale Detection Precision

　　Ultra-high positioning accuracy: 2D vision + confocal laser, alignment accuracy ±0.5μm, repeatability ±0.1μm—adapts to wafer circuit pattern (≤0.05μm line width) alignment.

　　Flatness & thickness measurement: Sub-pixel algorithm + laser triangulation, measures wafer thickness (50-100μm) with ±0.2μm accuracy, flatness deviation ≤0.5μm/24-inch—avoids thin-wafer warpage-induced detection errors.

　　Low-distortion imaging: 2000 万像素 high-resolution CMOS, optical distortion ≤0.1%, ensures no circuit pattern deformation during full-wafer scanning.

　　2. Micro-Defect Recognition Capability

　　Defect coverage: Identifies scratches (≥0.1μm width), bubbles (≥0.5μm diameter), and circuit open/short defects—supports bright/dark field switching to enhance defect contrast (e.g., dark field for micro-scratches).

　　Detection efficiency: Full 24-inch wafer scanning ≤5 minutes, defect recognition rate ≥99.95%—matches semiconductor mass production rhythm.

　　False-positive control: AI-assisted defect classification (scratch/bubble/circuit error), false-positive rate ≤0.01%—reduces manual recheck workload.

　　3. Wafer Adaptability & Cleanroom Compatibility

　　Wafer size support: Compatible with 12/18/24-inch wafers, adaptive chuck design—no hardware replacement for size switching; thin-wafer (50μm) non-destructive positioning (vacuum suction + soft contact).

　　Cleanroom compliance: Class 10 cleanroom rating, anti-static (ESD ≤100V) shell, no particle shedding (≤1 particle/ft³, ≥0.1μm)—meets semiconductor fab environment requirements.

　　Corrosion resistance: Chemical-resistant coating (resists wafer cleaning agents like HF vapor)—extends service life in harsh fab environments.

　　4. System Integration & Data Tracing

　　Fab system compatibility: Supports SECS/GEM protocol, links to semiconductor MES—real-time uploads defect coordinates (e.g., "Wafer ID: W2501, Defect: 0.3μm scratch at (X:12.5mm,Y:8.3mm)") for yield analysis.

　　Full-wafer data mapping: Generates defect distribution heatmap, records scanning parameters (exposure, focus)—enables traceability of each wafer inspection process.

　　Remote monitoring: Controls inspection via cleanroom external console—reduces personnel entry (avoids contamination risk).

　　5. Typical Application Scenarios

　　Wafer appearance inspection: Detects 0.1μm scratches/bubbles on 24-inch wafers, recognition rate 99.98%—cuts appearance-related yield loss by 60%.

　　Circuit pattern inspection: Identifies 0.05μm line-width deviations in wafer circuits, false-positive rate 0.008%—ensures chip function reliability.

　　Thin-wafer inspection: Non-destructive positioning of 50μm thin wafers, thickness measurement accuracy ±0.2μm—avoids wafer breakage (damage rate ≤0.01%).

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